Method of forming SIP module over film layer

ABSTRACT

A semiconductor device has a semiconductor die or component, including an IPD, disposed over an attach area of a penetrable film layer with a portion of the semiconductor die or component embedded in the penetrable film layer. A conductive layer is formed over a portion of the film layer within the attach area and over a portion of the film layer outside the attach area. An encapsulant is deposited over the film layer, conductive layer, and semiconductor die or component. The conductive layer extends outside the encapsulant. An insulating material can be disposed under the semiconductor die or component. A shielding layer is formed over the encapsulant. The shielding layer is electrically connected to the conductive layer. The penetrable film layer is removed. The semiconductor die or component disposed over the film layer and covered by the encapsulant and shielding layer form an SIP module without a substrate.

FIELD OF THE INVENTION

The present invention relates in general to semiconductor devices and,more particularly, to a semiconductor device and method of forming anSIP module over a film layer.

BACKGROUND OF THE INVENTION

Semiconductor devices are commonly found in modern electronic products.Semiconductor devices perform a wide range of functions such as signalprocessing, high-speed calculations, transmitting and receivingelectromagnetic signals, controlling electronic devices, transformingsunlight to electricity, and creating visual images for televisiondisplays. Semiconductor devices are found in the fields ofcommunications, power conversion, networks, computers, entertainment,and consumer products. Semiconductor devices are also found in militaryapplications, aviation, automotive, industrial controllers, and officeequipment.

Semiconductor devices, particular in high frequency applications such asradio frequency (RF) wireless communications, often contain one or moreintegrated passive devices (IPDs) to perform necessary electricalfunctions. The IPDs are susceptible to electromagnetic interference(EMI), radio frequency interference (RFI), harmonic distortion, or otherinter-device interference, such as capacitive, inductive, or conductivecoupling, also known as cross-talk, which can interfere with theiroperation. The high-speed switching of digital circuits also generatesinterference.

Multiple semiconductor die and discrete IPDs can be integrated into asystem-in-package (SIP) module for higher density in a small space andextended electrical functionality. The semiconductor die and discreteIPDs are mounted to a substrate for structural support and electricalinterconnect. An encapsulant is deposited over the semiconductor die,discrete IPDs, and substrate. A shielding layer is formed over theencapsulant to isolate sensitive circuits. The SIP module substrate isphysically mounted and electrically connected to a board in the nextlevel of integration. The substrate can limit design flexibility,increase profile or thickness of the SIP module, and increasemanufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1a-1c illustrate a semiconductor wafer with a plurality ofsemiconductor die separated by a saw street;

FIGS. 2a-2o illustrate a process of forming an SIP module with ashielding layer over a penetrable film layer;

FIGS. 3a-3b illustrate the SIP module as formed over a penetrable filmlayer from FIGS. 2a -2 o;

FIGS. 4a-4c illustrate another process of forming an SIP module with ashielding layer over a penetrable film layer;

FIG. 5 illustrates the SIP module as formed over a penetrable film layerfrom FIGS. 4a -4 c;

FIG. 6 illustrates another embodiment of the SIP module with underfillmaterial under the electrical components; and

FIG. 7 illustrates a printed circuit board (PCB) with different types ofpackages mounted to a surface of the PCB.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention is described in one or more embodiments in thefollowing description with reference to the figures, in which likenumerals represent the same or similar elements. While the invention isdescribed in terms of the best mode for achieving the invention'sobjectives, it will be appreciated by those skilled in the art that itis intended to cover alternatives, modifications, and equivalents as maybe included within the spirit and scope of the invention as defined bythe appended claims and their equivalents as supported by the followingdisclosure and drawings. The term “semiconductor die” as used hereinrefers to both the singular and plural form of the words, andaccordingly, can refer to both a single semiconductor device andmultiple semiconductor devices.

Semiconductor devices are generally manufactured using two complexmanufacturing processes: front-end manufacturing and back-endmanufacturing. Front-end manufacturing involves the formation of aplurality of die on the surface of a semiconductor wafer. Each die onthe wafer contains active and passive electrical components, which areelectrically connected to form functional electrical circuits. Activeelectrical components, such as transistors and diodes, have the abilityto control the flow of electrical current. Passive electricalcomponents, such as capacitors, inductors, and resistors, create arelationship between voltage and current necessary to perform electricalcircuit functions.

Back-end manufacturing refers to cutting or singulating the finishedwafer into the individual semiconductor die and packaging thesemiconductor die for structural support, electrical interconnect, andenvironmental isolation. To singulate the semiconductor die, the waferis scored and broken along non-functional regions of the wafer calledsaw streets or scribes. The wafer is singulated using a laser cuttingtool or saw blade. After singulation, the individual semiconductor dieare mounted to a package substrate that includes pins or contact padsfor interconnection with other system components. Contact pads formedover the semiconductor die are then connected to contact pads within thepackage. The electrical connections can be made with conductive layers,bumps, stud bumps, conductive paste, or wirebonds. An encapsulant orother molding material is deposited over the package to provide physicalsupport and electrical isolation. The finished package is then insertedinto an electrical system and the functionality of the semiconductordevice is made available to the other system components.

FIG. 1a shows a semiconductor wafer 100 with a base substrate material102, such as silicon, germanium, aluminum phosphide, aluminum arsenide,gallium arsenide, gallium nitride, indium phosphide, silicon carbide, orother bulk material for structural support. A plurality of semiconductordie or components 104 is formed on wafer 100 separated by a non-active,inter-die wafer area or saw street 106. Saw street 106 provides cuttingareas to singulate semiconductor wafer 100 into individual semiconductordie 104. In one embodiment, semiconductor wafer 100 has a width ordiameter of 100-450 millimeters (mm).

FIG. 1b shows a cross-sectional view of a portion of semiconductor wafer100. Each semiconductor die 104 has a back or non-active surface 108 andan active surface 110 containing analog or digital circuits implementedas active devices, passive devices, conductive layers, and dielectriclayers formed within the die and electrically interconnected accordingto the electrical design and function of the die. For example, thecircuit may include one or more transistors, diodes, and other circuitelements formed within active surface 110 to implement analog circuitsor digital circuits, such as digital signal processor (DSP), applicationspecific integrated circuits (ASIC), memory, or other signal processingcircuit. Semiconductor die 104 may also contain IPDs, such as inductors,capacitors, and resistors, for RF signal processing.

An electrically conductive layer 112 is formed over active surface 110using PVD, CVD, electrolytic plating, electroless plating process, orother suitable metal deposition process. Conductive layer 112 can be oneor more layers of aluminum (Al), copper (Cu), tin (Sn), nickel (Ni),gold (Au), silver (Ag), or other suitable electrically conductivematerial. Conductive layer 112 operates as contact pads electricallyconnected to the circuits on active surface 110.

An electrically conductive bump material is deposited over conductivelayer 112 using an evaporation, electrolytic plating, electrolessplating, ball drop, or screen printing process. The bump material can beAl, Sn, Ni, Au, Ag, Pb, Bi, Cu, solder, and combinations thereof, withan optional flux solution. For example, the bump material can beeutectic Sn/Pb, high-lead solder, or lead-free solder. The bump materialis bonded to conductive layer 112 using a suitable attachment or bondingprocess. In one embodiment, the bump material is reflowed by heating thematerial above its melting point to form balls or bumps 114. In oneembodiment, bump 114 is formed over an under bump metallization (UBM)having a wetting layer, barrier layer, and adhesive layer. Bump 114 canalso be compression bonded or thermocompression bonded to conductivelayer 112. Bump 114 represents one type of interconnect structure thatcan be formed over conductive layer 112. The interconnect structure canalso use bond wires, conductive paste, stud bump, micro bump, or otherelectrical interconnect.

In FIG. 1c , semiconductor wafer 100 is singulated through saw street106 using a saw blade or laser cutting tool 118 into individualsemiconductor die 104. The individual semiconductor die 104 can beinspected and electrically tested for identification of KGD postsingulation.

FIGS. 2a-2o illustrate a process of forming an SIP module over apenetrable film layer. FIG. 2a shows a cross-sectional view of a portionof a carrier or temporary substrate 120 containing sacrificial basematerial such as silicon, polymer, beryllium oxide, glass, or othersuitable low-cost, rigid material for structural support. Carrier 150can be circular or rectangular according to the design or function ofthe semiconductor package. An interface layer or double-sided tape 122is formed over carrier 120 as a temporary adhesive bonding film layer,etch-stop layer, or thermal release layer. In one embodiment, interfacelayer 122 includes polyimide or acrylic film.

A penetrable film layer 124 is formed over carrier 120 using PVD, CVD,printing, spin coating, spray coating, slit coating, rolling coating,lamination, or sintering. In one embodiment, film layer 124 is apolymer, epoxy, acryl-based B-stage material, or other similar materialwith penetrable properties. Film layer 124 has a thickness of 125micrometers (μm). Alternatively, film layer 124 can be one or morelayers of silicon dioxide (SiO2), silicon nitride (Si3N4), siliconoxynitride (SiON), tantalum pentoxide (Ta2O5), aluminum oxide (Al2O3),silicon dioxide (SiO2), silicon nitride (Si2n4), silicon oxynitride(SiON), tantalum pentoxide (Ta2O5), aluminum oxide (Al2O3), polyimide,benzocyclobutene (BCB), polybenzoxazoles (PBO), or other material havingsimilar insulating and structural properties. Film layer 124 operates asa temporary penetrable substrate for attachment of electroniccomponents.

In FIG. 2b , semiconductor die 104 from FIG. 1c is positioned over andaffixed to penetrable film layer 124 using a pick and place operationwith active surface 110 and bumps 114 oriented toward the film layer.Likewise, discrete electronic component 130 is also positioned over andaffixed to penetrable film layer 124. In one embodiment, discreteelectronic component 130 is semiconductor device or IPD, such as aresistor, capacitor, and inductor. Bumps, conductive paste, or otherelectrical interconnects 136 provides electrical interconnect fordiscrete electronic component 130. A portion of semiconductor die 104,e.g. bumps 114, and a portion of discrete electronic component 130, e.g.electrical interconnects 136, are embedded in film layer 124.Alternatively, conductive layer 112 on active surface 110 ofsemiconductor die 104 and connection terminals of discrete electroniccomponent 130 penetrate into film layer 124. Film layer 124 has a lowviscosity allowing bumps 114, electrical interconnects 136, andconnection terminals of semiconductor die 104 and discrete electroniccomponent 130 to penetrate into the film layer.

FIG. 2c shows a cross-sectional view, taken through line 2 c-2 c of FIG.2d , of semiconductor die 104 and discrete electronic component 130affixed to penetrable film layer 124 as reconstituted wafer 126. In oneembodiment, only discrete electronic components 130 are affixed topenetrable film layer 124.

FIG. 2d shows a plan view of multiple instances of semiconductor die 104and discrete electronic component 130 affixed to film layer 124 incomponent attach areas 140 of reconstituted wafer 126. A first group ofsemiconductor die 104 and discrete electronic components 130 is disposedin component attach area 140 a, a second group of semiconductor die 104and discrete electronic components 130 is disposed in component attacharea 140 b, a third group of semiconductor die 104 and discreteelectronic components 130 is disposed in component attach area 140 c,and a fourth group of semiconductor die 104 and discrete electroniccomponents 130 is disposed in component attach area 140 d.

In another embodiment, semiconductor die 104 is positioned over andaffixed to interface layer 122 of carrier 120, without penetrable filmlayer 124, using a pick and place operation with active surface 110oriented toward the film layer, see FIG. 2e . Likewise, discreteelectronic component 130 is also positioned over and affixed tointerface layer 122. A surface of semiconductor die 104 and a surface ofdiscrete electronic component 130 contact interface layer 122. In yetanother embodiment, semiconductor die 104, without bumps 114, anddiscrete electronic component 130, without electrical interconnects 136,are disposed on penetrable film layer 124, i.e. a surface ofsemiconductor die 104 and a surface of discrete electronic component 130contact the penetrable film layer, as shown in FIG. 2 f.

Returning to FIG. 2c , an electrically conductive layer 142 is formedover a portion of component attach areas 140 a-140 d and over a portionof area 144 between the component attach areas of film layer 124 usingPVD, CVD, electrolytic plating, electroless plating process, or othersuitable metal deposition process, as shown in FIG. 2g . Conductivelayer 142 can be one or more layers of Al, Cu, Sn, Ni, Au, Ag, or othersuitable electrically conductive material. Conductive layer 142 isarranged at the corners of component attach areas 140 a-140 d. Thesegments of conductive layer 142 can be electrically isolated orelectrically common depending on the design and function ofsemiconductor die 104 and discrete electronic components 130. FIG. 2hshows a plan view of conductive layer 142 covering a portion ofcomponent attach areas 140 a-140 d and overlapping a portion of area 144of film layer 124 between the component attach areas.

FIG. 2i illustrates another embodiment of conductive layer 142 formed assegments at the corners and around each side of component attach areas140 a-140 d. The individual segments of conductive layer 142 can be aselectrically isolated or electrically common depending on the design andfunction of semiconductor die 104 and discrete electronic components130. FIG. 2j illustrates another embodiment of conductive layer 142formed with a rounded shape at the corners of component attach areas 140a-140 d.

In FIG. 2k , an encapsulant or molding compound 146 is deposited oversemiconductor die 104, discrete electronic component 130, film layer124, and a portion of conductive layer 142 using a paste printing,compressive molding, transfer molding, liquid encapsulant molding,vacuum lamination, spin coating, or other suitable applicator.Encapsulant 146 can be polymer composite material, such as epoxy resinwith filler, epoxy acrylate with filler, or polymer with proper filler.Encapsulant 146 is non-conductive, provides structural support, andenvironmentally protects the semiconductor device from external elementsand contaminants. In one embodiment, encapsulant 146 covers top surfacesand side surfaces of semiconductor die 104 and discrete electroniccomponent 130, as well as between the semiconductor die and discreteelectronic component and film layer 124. FIG. 2l shows a plan view ofencapsulant 146 covering component attach areas 140 a-140 d and aportion of conductive layer 142 on reconstituted wafer 126.

In FIG. 2m , reconstituted wafer 126 is singulated through areas 144using a saw blade or laser cutting tool 148 into individual SIP modules150. FIG. 2n shows SIP module 150 containing, for example, the firstgroup of semiconductor die 104 and discrete electronic components 130 asdisposed in component attach area 140 a. A portion of conductive layer142 extends laterally outside encapsulant 146 by nature of theconductive layer overlapping a portion of area 144 of film layer 124between the component attach areas 140 a-140 b.

Semiconductor die 104 and discrete electrical component 130 may containIPDs that are susceptible to EMI, RFI, harmonic distortion, andinter-device interference. For example, the IPDs contained withinsemiconductor die 104 and discrete electrical component 130 provide theelectrical characteristics needed for high frequency applications, suchas resonators, high-pass filters, low-pass filters, band-pass filters,symmetric Hi-Q resonant transformers, and tuning capacitors.

To reduce the effects of EMI and RFI, shielding layer 154 is formed overmajor surface 156 and side surfaces 158 of encapsulant 146, as shown inFIG. 2o . Shielding layer 154 can be one or more layers of Al, Cu, Sn,Ni, Au, Ag, or other suitable conductive material. Alternatively,shielding layer 154 can be carbonyl iron, stainless steel, nickelsilver, low-carbon steel, silicon-iron steel, foil, conductive resin,carbon-black, aluminum flake, and other metals and composites capable ofreducing the effects of EMI, RFI, and other inter-device interference.Shielding layer 154 is electrically connected to conductive layer 142 asan external ground point of SIP module 150 to reduce the influence ofEMI and RFI on semiconductor die 104 and discrete electronic component130.

The temporary carrier 120, interface layer 122, and penetrable filmlayer 124 are removed by chemical etching, mechanical peel-off, CMP,mechanical grinding, thermal bake, ultra-violet (UV) light, laserscanning, or wet stripping to expose bumps 114 of semiconductor die 104and electrical interconnects 136 of discrete electronic component 130,or other connection terminals of the semiconductor die and discreteelectronic component. Carrier 120, interface layer 122, and penetrablefilm layer 124 can be removed prior to singulation in FIG. 2 m.

FIG. 3a illustrates SIP module 150 with shielding layer 154 coveringmajor surface 156 and side surfaces 158 of encapsulant 146. Shieldinglayer 154 electrically contacts conductive layer 142 as an externalground point to reduce the influence of EMI and RFI on SIP module 150.Semiconductor die 104 and discrete electronic component 130 areinitially affixed to film layer 124, with bumps 114 and electricalinterconnects 136 embedded within the film layer. Semiconductor die 104and discrete electronic component 130 are covered by encapsulant 146.When film layer 124 is removed, semiconductor die 104 and discreteelectronic component 130 continue to be supported by encapsulant 146within SIP module 150, without a substrate. Bumps 114 and electricalinterconnects 136 can formed after removing carrier 120, interface layer122, and film layer 124. In the case of a surface of semiconductor die104 and a surface of discrete electronic component 130 being disposed oninterface layer 122 or penetrable film layer 124, see FIGS. 2e and 2f ,bumps 114 and electrical interconnects 136 can formed after formingshielding layer 154, or after removing carrier 120, interface layer 122,and film layer 124.

FIG. 3b shows a bottom view of SIP module 150 with bumps 114 andelectrical interconnects 136 exposed from encapsulant 146 for externalelectrical interconnect. Alternatively, connection terminals ofsemiconductor die 104 and discrete electronic component 130 are exposedfrom encapsulant 146 for external electrical interconnect. Trace lines160 are formed over encapsulant 146 and provide an electrical connectionbetween conductive layer 142 and bumps 114 and electrical interconnects136. The process of forming SIP module 150 over removable film layer124, without a substrate, provides higher design flexibility, lowerprofile, reduced defects and failures, and lower manufacturing cost.

In another embodiment continuing from FIG. 2g , an encapsulant ormolding compound 166 is deposited over semiconductor die 104, discreteelectronic component 130, film layer 124, and a portion of conductivelayer 142 using a paste printing, compressive molding, transfer molding,liquid encapsulant molding, vacuum lamination, spin coating, or othersuitable applicator, as shown in FIG. 4a . Encapsulant 166 can bepolymer composite material, such as epoxy resin with filler, epoxyacrylate with filler, or polymer with proper filler. Encapsulant 166 isnon-conductive, provides structural support, and environmentallyprotects the semiconductor device from external elements andcontaminants. In one embodiment, encapsulant 166 covers top surfaces andside surfaces of semiconductor die 104 and discrete electronic component130, as well as between the semiconductor die and discrete electroniccomponent and film layer 124.

In FIG. 4b , reconstituted wafer 168 is singulated through areas 144using a saw blade or laser cutting tool 169 into individual SIP modules170.

Semiconductor die 104 and discrete electrical component 130 may containIPDs that are susceptible to EMI, RFI, harmonic distortion, andinter-device interference. For example, the IPDs contained withinsemiconductor die 104 and discrete electrical component 130 provide theelectrical characteristics needed for high frequency applications, suchas resonators, high-pass filters, low-pass filters, band-pass filters,symmetric Hi-Q resonant transformers, and tuning capacitors.

To reduce the effects of EMI and RFI, shielding layer 174 is formed overmajor surface 176 and side surfaces 178 of encapsulant 146 and sidesurfaces 179 of conductive layer 142 in SIP module 170, as shown in FIG.4c . Shielding layer 154 can be one or more layers of Al, Cu, Sn, Ni,Au, Ag, or other suitable conductive material. Alternatively, shieldinglayer 174 can be carbonyl iron, stainless steel, nickel silver,low-carbon steel, silicon-iron steel, foil, conductive resin,carbon-black, aluminum flake, and other metals and composites capable ofreducing the effects of EMI, RFI, and other inter-device interference.Shielding layer 174 is electrically connected to conductive layer 142 asan external ground point of SIP module 170 to reduce the influence ofEMI and RFI on semiconductor die 104 and discrete electronic component130.

The temporary carrier 120 and interface layer 122 are removed bychemical etching, mechanical peel-off, CMP, mechanical grinding, thermalbake, ultra-violet (UV) light, laser scanning, or wet stripping toexpose bumps 114 of semiconductor die 104 and electrical interconnects136 of discrete electronic component 130, or other connection terminalsof the semiconductor die and discrete electronic component. Carrier 120,interface layer 122, and penetrable film layer 124 can be removed priorto singulation in FIG. 4 b.

FIG. 5 illustrates SIP module 170 with shielding layer 174 coveringmajor surface 176 and side surfaces 178 of encapsulant 146 and sidesurfaces 179 of conductive layer 142. Shielding layer 174 electricallycontacts conductive layer 142 as an external ground point to reduce theinfluence of EMI and RFI on SIP module 170. Semiconductor die 104 anddiscrete electronic component 130 are initially affixed to film layer124, with bumps 114 and electrical interconnects 136 embedded within thefilm layer. Semiconductor die 104 and discrete electronic component 130are covered by encapsulant 166. When film layer 124 is removed,semiconductor die 104 and discrete electronic component 130 continue tobe supported by encapsulant 166 within SIP module 170, without asubstrate. Bumps 114 and electrical interconnects 136 can formed afterremoving carrier 120, interface layer 122, and film layer 124. In thecase of a surface of semiconductor die 104 and a surface of discreteelectronic component 130 being disposed on interface layer 122 orpenetrable film layer 124, see FIGS. 2e and 2f , bumps 114 andelectrical interconnects 136 can formed after forming shielding layer174, or after removing carrier 120, interface layer 122, and film layer124.

FIG. 6 illustrates another embodiment of SIP module 190, similar to FIG.5, with underfill or insulating material 192, such as epoxy resin,deposited around bumps 114 of semiconductor die 104 and aroundelectrical interconnects of discrete electronic component 130.

FIG. 7 illustrates electronic component 200 having a chip carriersubstrate or PCB 202 with a plurality of semiconductor packages mountedon a surface of PCB 202, including SIP modules 150 and 170. Electronicdevice 200 can have one type of semiconductor package, or multiple typesof semiconductor packages, depending on the application.

Electronic device 200 can be a stand-alone system that uses thesemiconductor packages to perform one or more electrical functions.Alternatively, electronic device 200 can be a subcomponent of a largersystem. For example, electronic device 200 can be part of a tablet,cellular phone, digital camera, communication system, or otherelectronic device. Alternatively, electronic device 200 can be agraphics card, network interface card, or other signal processing cardthat can be inserted into a computer. The semiconductor package caninclude microprocessors, memories, ASIC, logic circuits, analogcircuits, RF circuits, discrete devices, or other semiconductor die orelectrical components. Miniaturization and weight reduction areessential for the products to be accepted by the market. The distancebetween semiconductor devices may be decreased to achieve higherdensity.

In FIG. 7, PCB 202 provides a general substrate for structural supportand electrical interconnect of the semiconductor packages mounted on thePCB. Conductive signal traces 204 are formed over a surface or withinlayers of PCB 202 using evaporation, electrolytic plating, electrolessplating, screen printing, or other suitable metal deposition process.Signal traces 204 provide for electrical communication between each ofthe semiconductor packages, mounted components, and other externalsystem components. Traces 204 also provide power and ground connectionsto each of the semiconductor packages.

In some embodiments, a semiconductor device has two packaging levels.First level packaging is a technique for mechanically and electricallyattaching the semiconductor die to an intermediate substrate. Secondlevel packaging involves mechanically and electrically attaching theintermediate substrate to the PCB. In other embodiments, a semiconductordevice may only have the first level packaging where the die ismechanically and electrically mounted directly to the PCB.

For the purpose of illustration, several types of first level packaging,including bond wire package 206 and flipchip 208, are shown on PCB 202.Additionally, several types of second level packaging, including ballgrid array (BGA) 210, bump chip carrier (BCC) 212, land grid array (LGA)216, multi-chip module (MCM) 218, quad flat non-leaded package (QFN)220, quad flat package 222, embedded wafer level ball grid array (eWLB)224, and wafer level chip scale package (WLCSP) 226 are shown mounted onPCB 202. In one embodiment, eWLB 224 is a fan-out wafer level package(Fo-WLP) and WLCSP 226 is a fan-in wafer level package (Fi-WLP).Depending upon the system requirements, any combination of semiconductorpackages, configured with any combination of first and second levelpackaging styles, as well as other electronic components, can beconnected to PCB 202. In some embodiments, electronic device 200includes a single attached semiconductor package, while otherembodiments call for multiple interconnected packages. By combining oneor more semiconductor packages over a single substrate, manufacturerscan incorporate pre-made components into electronic devices and systems.Because the semiconductor packages include sophisticated functionality,electronic devices can be manufactured using less expensive componentsand a streamlined manufacturing process. The resulting devices are lesslikely to fail and less expensive to manufacture resulting in a lowercost for consumers.

While one or more embodiments of the present invention have beenillustrated in detail, the skilled artisan will appreciate thatmodifications and adaptations to those embodiments may be made withoutdeparting from the scope of the present invention as set forth in thefollowing claims.

What is claimed:
 1. A method of making a semiconductor device,comprising: providing a penetrable film layer; disposing a semiconductordie or component onto an attach area of the penetrable film layer withan electrically conductive portion of the semiconductor die or componentembedded within the penetrable film layer; forming a conductive layer incontact with the penetrable film layer, wherein the conductive layerextends over a first portion of the penetrable film layer within theattach area of the penetrable film layer under the semiconductor die tocontact the electrically conductive portion of the semiconductor die andfurther over a second portion of the penetrable film layer outside theattach area of the penetrable film layer; depositing an encapsulant overthe penetrable film layer, conductive layer, and semiconductor die orcomponent; forming an electromagnetic shielding layer on a top surfaceand a side surface of the encapsulant, with the electromagneticshielding layer on the side surface of the encapsulant extending tocontact the conductive layer; and removing the penetrable film layer toexpose the electrically conductive portion of the semiconductor die orcomponent after forming the electromagnetic shielding layer.
 2. Themethod of claim 1, wherein the electromagnetic shielding layer iselectrically connected to the conductive layer.
 3. The method of claim1, further including disposing an insulating material under thesemiconductor die or component.
 4. The method of claim 1, wherein theelectrically conductive portion of the semiconductor die or componentembedded within the penetrable film layer includes a plurality of bumps.5. A method of making a semiconductor device, comprising: providing asubstrate; disposing an electrical component onto an attach area of thesubstrate with an electrically conductive portion of the electricalcomponent embedded within the substrate; forming a conductive layer overthe substrate, wherein the conductive layer extends over a first portionof the substrate within the attach area of the substrate under theelectrical component to contact the electrically conductive portion ofthe electrical component and further over a second portion of thesubstrate outside the attach area of the substrate; depositing anencapsulant over the substrate, conductive layer, and electricalcomponent; forming an electromagnetic shielding layer, with theelectromagnetic shielding on a top surface and a side surface of theencapsulant layer on the side surface of the encapsulant extending tocontact the conductive layer; and removing the substrate to expose theelectrically conductive portion of the electrical component afterforming the electromagnetic shielding layer.
 6. The method of claim 5,wherein the electrically conductive portion of the electrical componentembedded within the substrate includes a plurality of bumps.
 7. Themethod of claim 5, wherein the shielding layer is electrically connectedto the conductive layer.
 8. The method of claim 5, further includingdisposing an insulating material under the electrical component.
 9. Themethod of claim 5, wherein the electrical component includes anintegrated passive device.
 10. A method of making a semiconductordevice, comprising: providing a penetrable substrate; disposing anelectrical component onto an attach area of the penetrable substratewith a portion of the electrical component embedded within thepenetrable substrate; forming a conductive layer in contact with thepenetrable substrate, wherein the conductive layer extends over a firstportion of the substrate within the attach area of the substrate underthe electrical component to contact the electrically conductive portionof the electrical component and further over a second portion of thesubstrate outside the attach area of the substrate; depositing anencapsulant over the substrate and electrical component after disposingan electrical component onto an attach area of the penetrable substrate;forming an electromagnetic shielding layer over the encapsulant, whereinthe electromagnetic shielding layer contacts the conductive layer; andremoving the penetrable substrate to expose the portion of theelectrical component after forming the shielding layer.
 11. The methodof claim 10, wherein the portion of the electrical component embeddedwithin the penetrable substrate includes a plurality of bumps.
 12. Themethod of claim 10, wherein the electromagnetic shielding layer iselectrically connected to the conductive layer.
 13. The method of claim10, further including disposing an insulating material under theelectrical component.
 14. The method of claim 10, wherein the electricalcomponent includes an integrated passive device.
 15. A method of makinga semiconductor device, comprising: providing a substrate; disposing anelectrical component onto an attach area of the substrate with a portionof the electrical component embedded within the substrate; forming aconductive layer over the substrate, wherein the conductive layerextends over a first portion of the substrate within the attach area ofthe substrate under the electrical component to contact the electricallyconductive portion of the electrical component and further over a secondportion of the substrate outside the attach area of the substrate;depositing an encapsulant over the substrate and electrical componentafter disposing an electrical component onto an attach area of thesubstrate; forming a shielding layer over the encapsulant, wherein theshielding layer contacts the conductive layer; and removing thesubstrate to expose the portion of the electrical component afterforming the shielding layer.
 16. The method of claim 15, wherein theportion of the electrical component embedded within the substrateincludes a plurality of bumps.
 17. The method of claim 15, wherein theshielding layer is electrically connected to the conductive layer. 18.The method of claim 15, further including disposing an insulatingmaterial under the electrical component.